Opening of R&D Center

Howa Sangyo Co., Ltd. announces the completion of construction and commencement of operations at its R&D Center in Funabashi City, Chiba.

The center is a facility for the development of next-generation packaging that combines high functionality with environmental friendliness. As well as streamlining development by consolidating experimental facilities that were previously scattered around the country, we will promote the development of mono-material packaging materials made from a single material by introducing a new test coater and improving the testing environment for coating agents, inks, adhesives, etc. The center will also be actively utilized for the development of production machinery to produce new package shapes we have developed in-house.

In addition, we plan to make the center a place for open innovation through collaboration with other companies. We hope to further accelerate the development of packaging by encouraging more personal exchanges between researchers and developers involved in flexible packaging and promoting the accumulation and sharing of technology and knowledge.

We are committed to providing packaging that will further satisfy our customers by building on our solid technological capabilities to meet changing social conditions and customer needs.

Overview of R&D Center
Location 4-11-3 Narashino, Funabashi-shi, Chiba
Access
  • Take the Keisei Bus bound for Narashino Branch from Tsudanuma Station on the JR Sobu Line
    3-minute walk from the Howa Sangyo-mae bus stop
  • Take the Shin-Keisei Bus bound for Narashino Shako from Kita-Narashino Station on the Toyo Rapid Railway
    1-minute walk from the Howa Sangyo Honsha bus stop
Total floor space 1193.88㎡
Building area 569.16㎡

Please check our website [Howa Network] for details of location and contact information.